Electronics Laboratory

Precision starts with the right tools. Our laboratory is the heart of A&D Serwis – a fully equipped ESD-safe zone combining diagnostics, BGA rework, and environmental testing. This allows us to bring even the most complex electronic and opto-mechanical systems back to life.

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Download the equipment list (PDF)

Workstations

40 × ESD service stations with height adjustment, ionization, and fume extraction.

10 × island rework stations with IR preheater and hot air for BGA/µBGA systems.

AC/DC motor repair workstation – test bench with 0–400 Hz inverters, winding analyzer and brake tester up to 75 kW; allows for the diagnosis, rewinding and testing of single-phase, three-phase and DC brush motors.

Clean area for dust-sensitive work (optoelectronics, fiber optics).

Microdrive maintenance station – cleaning and lubrication chamber, balancing machine and vibration tester for servo mechanisms and brushless DC motors up to 1 kW.

Precision sandblasting station – closed pressure cabin with 0.4–1 mm nozzles, abrasive recirculation and HEPA filter; allows gentle removal of oxidation and old coatings from plates, heat sinks and mechanical components prior to soldering or spraying.

Key equipment

Equipment

Application

Signal diagnostics

350 MHz digital oscilloscopes (Rigol/Keysight), 3 GHz spectrum analyzer

Bus, RF, and clock signal testing

Electrical measurements

6.5-digit multimeters, ESR meters, micro-ohm meters < 1 µΩ

Precise measurements of components and tracks

Rework & soldering

JBC and Hakko stations, 1000 W hot air, YH-853A IR heater, lead-free solders

BGA/QFN replacement, reballing, micro-soldering

Optical inspection

10-90× trinocular microscopes with 4K camera, AOI, HD PCB endoscope

Quality control of solder joints, tracks, and connectors

Thermography

Fluke TiX580 camera, IR pyrometer

Hot spot detection, thermal analysis

Programming & testing

Over 20 types of programmers, including TL866II, JTAG/SWD, Boundary-Scan, in-circuit emulator

Flashing, debugging, functional testing

Power analysis

0-60 V / 10 A power supplies, 300 W electronic load

Load testing, PSU characteristics

X-ray inspection

RTG BGA VJ Electronix XQuik II

Evaluation of CSP/BGA connections

Laboratory procedures

BGA rework - reflow profile, Sn-Ag-Cu ball reballing, X-ray inspection.

Failure analysis (FA) & 8D report - microscopy, thermography; we prepare a full 8D report with root causes and corrective recommendations.

PCB computed tomography - digital 3D “X-ray” for analyzing internal laminate damage and solder porosity. Work and opinions in cooperation with the Institute of Photonics and Microsystems at the Wrocław University of Technology.

TME equipment calibration - precise tuning of encoders, calibration of force, temperature, and pressure sensors. Test stations carried out in cooperation with industry partners and accredited institutions.

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